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High reactivity with amine and anhydride hardeners for rapid cure at ambient or elevated temperatures.
Excellent adhesion to metals, composites, and cured polymer substrates.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing, impregnation, and flow control.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good thermal stability and chemical resistance to moisture, weak acids, and solvents.
Electrical potting and encapsulation of transformers, reactors, and high-voltage components.
Insulating coatings and busbar protection in power distribution systems.
Matrix resin for glass-fiber reinforced laminates in electrical insulation boards.
Structural adhesive formulations requiring high bond strength and thermal endurance.
Core material in dry-type cast-resin transformers and reactor windings.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear, amber-colored low-viscosity liquid |
| Appearance | Homogeneous, transparent, slightly viscous liquid |
| Epoxy Equivalent Weight (EEW) | 178–184 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Electrical insulation, potting, casting, and laminating |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
