Highly reactive latent curing agent for epoxy systems, enabling extended pot life at ambient temperature.
Excellent thermal stability with decomposition onset above 200 °C, supporting high-temperature cure profiles.
Low volatility and minimal odor, enhancing workplace safety and compliance with industrial hygiene standards.
Superior compatibility with standard DGEBA-type epoxy resins and modified epoxies.
Enables fast, low-energy post-cure cycles—achieving full crosslink density at 150–180 °C in under 60 minutes.
Aerospace composite pre-pregs requiring precise cure control and high Tg performance.
Electronics encapsulation and underfill formulations demanding low ionic impurity and high reliability.
High-performance adhesive systems for structural bonding in automotive and rail applications.
Wind turbine blade matrix resins where extended working time and rapid final cure are critical.
Advanced tooling and mold-making compounds requiring dimensional stability and low exotherm.
| Chemical Type | Imidazoline-based latent epoxy curing agent |
| Product Form | Off-white to light tan crystalline powder |
| Appearance | Free-flowing crystalline solid, no visible lumps or discoloration |
| Primary Applications | Latent hardener for high-performance epoxy composites, adhesives, and encapsulants |
| Key Features | Latent reactivity, low volatility, high thermal stability, excellent epoxy compatibility |
| Benefits | Extended shelf life, improved process safety, reduced energy consumption during cure |
| Recommended Storage | Below 25 °C in sealed original packaging, protected from moisture and direct sunlight |
| Handling Precautions | Use in well-ventilated areas; avoid inhalation of dust and contact with skin/eyes |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China