Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Shikoku 2E4MZ-CN Epoxy Resin

Shikoku’s 2E4MZ-CN epoxy resin is a high-performance, low-viscosity, cationic photopolymerizable cycloaliphatic epoxy under the 2E4MZ series—designed for UV-curable coatings, inks, and adhesives requiring rapid cure, excellent hardness, and low shrinkage.
  • shikoku 2e4mz cn epoxy resin_aac935cd
  • shikoku 2e4mz cn epoxy resin_aac935cd

Features Of Shikoku 2E4MZ-CN Epoxy Resin

  1. Highly reactive latent curing agent for epoxy systems, enabling extended pot life at ambient temperature.

  2. Excellent thermal stability with decomposition onset above 200 °C, supporting high-temperature cure profiles.

  3. Low volatility and minimal odor, enhancing workplace safety and compliance with industrial hygiene standards.

  4. Superior compatibility with standard DGEBA-type epoxy resins and modified epoxies.

  5. Enables fast, low-energy post-cure cycles—achieving full crosslink density at 150–180 °C in under 60 minutes.

Typical Applications Of Shikoku 2E4MZ-CN Epoxy Resin

  1. Aerospace composite pre-pregs requiring precise cure control and high Tg performance.

  2. Electronics encapsulation and underfill formulations demanding low ionic impurity and high reliability.

  3. High-performance adhesive systems for structural bonding in automotive and rail applications.

  4. Wind turbine blade matrix resins where extended working time and rapid final cure are critical.

  5. Advanced tooling and mold-making compounds requiring dimensional stability and low exotherm.

Specifications Of Shikoku 2E4MZ-CN Epoxy Resin

Chemical TypeImidazoline-based latent epoxy curing agent
Product FormOff-white to light tan crystalline powder
AppearanceFree-flowing crystalline solid, no visible lumps or discoloration
Primary ApplicationsLatent hardener for high-performance epoxy composites, adhesives, and encapsulants
Key FeaturesLatent reactivity, low volatility, high thermal stability, excellent epoxy compatibility
BenefitsExtended shelf life, improved process safety, reduced energy consumption during cure
Recommended StorageBelow 25 °C in sealed original packaging, protected from moisture and direct sunlight
Handling PrecautionsUse in well-ventilated areas; avoid inhalation of dust and contact with skin/eyes


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