High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and treated plastics without primer requirement.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing via casting, impregnation, or filament winding.
Superior electrical insulation properties with high dielectric strength (>18 kV/mm) and low dissipation factor.
Good thermal stability with glass transition temperature (Tg) of 125–135°C after post-cure.
Electrical insulation systems for medium-voltage dry-type transformers and reactors.
Encapsulation and potting of power electronics modules, including IGBTs and EV inverters.
Structural bonding and laminating in wind turbine blade root joints and nacelle components.
High-performance composite matrices for aerospace interior panels and radome substrates.
Coating and lining formulations for corrosion-resistant chemical process equipment.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gels and sediment |
| Epoxy Equivalent Weight (EEW) | 175–185 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Electrical insulation, structural composites, encapsulation |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China