Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

KUKDO SM604H Epoxy Resin

KUKDO SM604H Epoxy Resin is a high-performance liquid bisphenol-A epoxy resin from KUKDO’s SM series, offering excellent adhesion, chemical resistance and mechanical strength. Widely used in composites, coatings and electrical encapsulation, it features low viscosity, good reactivity with amines/anhydrides, and superior thermal stability. Ideal for demanding industrial applications requiring reliability and consistency.
  • kukdo sm604h epoxy resin_8e4d37a5
  • kukdo sm604h epoxy resin_8e4d37a5

Features Of KUKDO SM604H Epoxy Resin

  1. High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.

  2. Excellent adhesion to metals, composites, and treated plastics without primer requirement.

  3. Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing via casting, impregnation, or filament winding.

  4. Superior electrical insulation properties with high dielectric strength (>18 kV/mm) and low dissipation factor.

  5. Good thermal stability with glass transition temperature (Tg) of 125–135°C after post-cure.

Typical Applications Of KUKDO SM604H Epoxy Resin

  1. Electrical insulation systems for medium-voltage dry-type transformers and reactors.

  2. Encapsulation and potting of power electronics modules, including IGBTs and EV inverters.

  3. Structural bonding and laminating in wind turbine blade root joints and nacelle components.

  4. High-performance composite matrices for aerospace interior panels and radome substrates.

  5. Coating and lining formulations for corrosion-resistant chemical process equipment.

Specifications Of KUKDO SM604H Epoxy Resin

Chemical TypeBisphenol-F based liquid epoxy resin
Product FormClear to pale yellow viscous liquid
AppearanceHomogeneous, transparent, free from gels and sediment
Epoxy Equivalent Weight (EEW)175–185 g/eq
Viscosity (25°C)12,000–15,000 cP
Chloride Content≤ 500 ppm
Softening PointNot applicable (liquid at room temperature)
Primary ApplicationsElectrical insulation, structural composites, encapsulation


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