High-purity bisphenol-A based liquid epoxy resin with low chlorine content.
Excellent thermal stability and consistent reactivity for reliable curing performance.
Low viscosity (10,000–12,000 cP at 25°C) enabling easy handling and efficient impregnation.
Superior electrical insulation properties ideal for high-voltage applications.
Good compatibility with standard amine and anhydride hardeners across diverse formulations.
Electrical potting and encapsulation of transformers, reactors, and switchgear.
Insulating varnishes for motor and generator windings.
Laminating resins for high-performance printed circuit board (PCB) substrates.
Structural adhesives in aerospace and rail transportation components.
Composite matrix resin for filament-wound pressure vessels and insulating rods.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, pale yellow liquid |
| Appearance | Homogeneous, transparent, free from gel or sediment |
| Epoxy Equivalent Weight (EEW) | 183–192 g/eq |
| Viscosity (25°C) | 10,000–12,000 cP |
| Chloride Content | ≤ 700 ppm |
| Softening Point | 10–15°C |
| Volatiles (150°C, 2 hrs) | ≤ 0.3 wt% |
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E-mail: wangxingqiang@ericwchem.com
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