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Low molecular weight solid epoxy resin with high reactivity toward amines and anhydrides.
Excellent solubility in common organic solvents and compatibility with various thermoset resins.
Provides superior mechanical strength, chemical resistance, and thermal stability in cured systems.
Consistent batch-to-batch performance ensuring reliable processing in industrial formulations.
Designed for use in high-performance composites, adhesives, and powder coatings requiring low melt viscosity.
Aerospace composite matrices for structural components and interior panels.
High-voltage electrical encapsulants and insulating varnishes.
Powder coatings for metal substrates requiring durability and corrosion resistance.
Structural adhesives in automotive and wind energy applications.
Prepregs and filament-wound parts for demanding industrial environments.
| Chemical Type | Bisphenol-A based solid epoxy resin |
| Product Form | Off-white to light tan solid flakes or pellets |
| Appearance | Free-flowing granular solid at room temperature |
| Epoxy Equivalent Weight (EEW) | 485–515 g/eq |
| Melt Viscosity (at 150°C) | 3,000–6,000 cP |
| Glass Transition Temperature (Tg) | 50–65°C (uncured) |
| Softening Point | 75–85°C (ring-and-ball method) |
| Volatile Content | ≤ 0.5 wt% |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
