Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

KUKDO SMPN-638 Epoxy Resin

KUKDO SMPN-638 Epoxy Resin is a high-performance liquid bisphenol-A epoxy resin from KUKDO’s SMPN series offering excellent adhesion thermal stability and chemical resistance ideal for composites coatings and electrical encapsulation applications widely used in aerospace automotive and electronics industries.
  • kukdo smpn 638 epoxy resin_d1375651
  • kukdo smpn 638 epoxy resin_d1375651

Features Of KUKDO SMPN-638 Epoxy Resin

  1. High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.

  2. Excellent adhesion to metals, composites, and cured polymer substrates.

  3. Low viscosity (450–650 cP at 25°C) enabling easy processing, impregnation, and void-free casting.

  4. Superior thermal stability with glass transition temperature (Tg) up to 170°C after full cure.

  5. Low chloride content (< 800 ppm), ensuring compatibility with sensitive electronic encapsulation applications.

Typical Applications Of KUKDO SMPN-638 Epoxy Resin

  1. Electrical insulation systems for medium-voltage transformers and reactors.

  2. Structural adhesive formulations for aerospace composite bonding.

  3. Encapsulation and potting of power electronics and IGBT modules.

  4. High-performance laminating resin for prepreg and filament winding in wind turbine blades.

  5. Tooling and mold-making resins requiring dimensional stability and low exotherm.

Specifications Of KUKDO SMPN-638 Epoxy Resin

Chemical TypeBisphenol-F based liquid epoxy resin
Product FormClear, pale yellow liquid
AppearanceHomogeneous, transparent, free from gels or sediment
Epoxy Equivalent Weight (EEW)185–195 g/eq
Viscosity (25°C)500–600 cP
Chlorine Content≤ 750 ppm
Volatiles Content≤ 0.3 wt%
Storage Stability (25°C)≥ 12 months in sealed containers


Get in Touch with ERICW
Let competitive chemical materials go global.

Your Name *

Your Email *

Your Phone

Country

Your Message *