High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and cured polymer substrates.
Low viscosity (450–650 cP at 25°C) enabling easy processing, impregnation, and void-free casting.
Superior thermal stability with glass transition temperature (Tg) up to 170°C after full cure.
Low chloride content (< 800 ppm), ensuring compatibility with sensitive electronic encapsulation applications.
Electrical insulation systems for medium-voltage transformers and reactors.
Structural adhesive formulations for aerospace composite bonding.
Encapsulation and potting of power electronics and IGBT modules.
High-performance laminating resin for prepreg and filament winding in wind turbine blades.
Tooling and mold-making resins requiring dimensional stability and low exotherm.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear, pale yellow liquid |
| Appearance | Homogeneous, transparent, free from gels or sediment |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 500–600 cP |
| Chlorine Content | ≤ 750 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability (25°C) | ≥ 12 months in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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