High purity bisphenol-A based epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and low volatility during processing.
Superior adhesion to metals, glass, and composite substrates.
Low viscosity enabling easy handling, mixing, and impregnation in demanding formulations.
Compatible with standard amine and anhydride curing agents for broad formulation flexibility.
Electrical encapsulation and potting compounds for transformers and sensors.
High-performance structural adhesives in automotive and aerospace assemblies.
Prepregs and laminates for printed circuit board (PCB) base materials.
Composite matrix resin for wind turbine blades and carbon fiber reinforcements.
Protective coatings for corrosion-resistant industrial equipment and pipelines.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Liquid |
| Appearance | Clear, pale yellow viscous liquid |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12,000–15,000 cP |
| Chlorine Content | ≤ 800 ppm |
| Softening Point | 12–16°C |
| Volatiles Content | ≤ 0.3 wt% |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China