High-purity bisphenol-A based liquid epoxy resin with low chlorine content.
Excellent compatibility with standard amine and anhydride curing agents.
Low viscosity (10,000–12,000 cP at 25°C) enabling easy processing and impregnation.
Superior electrical insulation properties and thermal stability up to 130°C (Tg after full cure).
Consistent batch-to-batch performance meeting ISO 9001 manufacturing controls.
Electrical encapsulation and potting of transformers, reactors, and high-voltage insulators.
Structural adhesives for aerospace composite bonding and automotive metal-to-composite joints.
Matrix resin in filament-wound pressure vessels and FRP tanks for chemical service.
Coating systems for corrosion-resistant linings in steel pipelines and storage tanks.
Prepregs and laminates for printed circuit board (PCB) base materials requiring high CTI.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, pale yellow liquid |
| Appearance | Transparent, slightly viscous liquid without sediment or haze |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 10,000–12,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | 12–16°C |
| Volatiles Content | ≤ 0.3 wt% |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China