High-purity bisphenol-A based liquid epoxy resin with low chlorine content.
Excellent compatibility with common amine and anhydride curing agents.
Low viscosity (10,000–12,000 cP at 25°C) for easy processing and improved filler dispersion.
Superior mechanical strength and chemical resistance after full cure.
Consistent batch-to-batch quality meeting ISO 9001 manufacturing standards.
Electrical encapsulation and potting compounds for transformers and sensors.
High-performance adhesives for aerospace and automotive structural bonding.
Composite matrix resin for carbon fiber and glass fiber reinforced laminates.
Coating systems requiring corrosion resistance and UV stability.
Printed circuit board (PCB) laminates and prepreg formulations.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free of suspended particles |
| Epoxy Equivalent Weight (EEW) | 187–193 g/eq |
| Viscosity (25°C) | 10,000–12,000 cP |
| Chlorine Content | ≤ 800 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at <25°C in sealed containers |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China