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High-purity bisphenol-A based liquid epoxy resin with low chlorine content.
Excellent compatibility with standard amine and anhydride curing agents.
Consistent viscosity and molecular weight distribution for reliable process control.
Superior electrical insulation properties and thermal stability after curing.
Low volatility and minimal odor, supporting safer handling in industrial environments.
Electrical encapsulation and potting compounds for transformers and sensors.
High-voltage insulators and bushings requiring long-term dielectric performance.
Composite matrix resin for filament-wound pressure vessels and structural laminates.
Adhesives and coatings in aerospace and automotive under-hood components.
Prepreg systems for printed circuit board (PCB) laminates and advanced electronics substrates.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Pale yellow to water-white, transparent |
| Epoxy Equivalent Weight (EEW) | 184–190 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chlorine Content | ≤ 700 ppm |
| Softening Point | 12–16°C |
| Volatility (105°C, 2 hrs) | ≤ 0.3 wt% |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
