High reactivity with standard amine and anhydride hardeners for rapid cure at ambient or elevated temperatures.
Excellent adhesion to metals, composites, and concrete substrates without extensive surface preparation.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing, impregnation, and flow control in casting and potting applications.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good chemical resistance to dilute acids, alkalis, and aliphatic solvents after full cure.
Electrical encapsulation and potting of transformers, sensors, and power modules.
Structural adhesive formulations for aerospace and automotive composite bonding.
High-performance casting resins for industrial tooling, molds, and precision components.
Matrix resin in filament-wound pressure vessels and fiber-reinforced structural parts.
Underfill and conformal coating materials for electronics protection in harsh environments.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear to pale amber viscous liquid |
| Appearance | Homogeneous, transparent, free from gels or particulates |
| Epoxy Equivalent Weight (EEW) | 180–190 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Color (Gardner) | ≤3 |
| Volatile Content | <0.5 wt% |
| Primary Applications | Encapsulation, potting, structural adhesives, casting |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China