Low viscosity for excellent flow and air release in casting and impregnation processes.
High purity with minimal ionic contaminants, ensuring superior electrical insulation performance.
Excellent thermal stability and long pot life at ambient temperatures.
Compatible with standard amine and anhydride curing agents for flexible formulation design.
Low volatile organic compound (VOC) content, supporting environmentally responsible manufacturing.
Electrical encapsulation of transformers, reactors, and high-voltage insulators.
Impregnation of dry-type motor and generator windings.
Structural casting for precision electronic components and sensor housings.
Manufacturing of high-performance composite laminates for aerospace tooling.
Underfill and glob-top protection for power semiconductor modules.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Colorless to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity at 25°C | 8,000–12,000 cP |
| Chloride Content | < 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at < 25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China