High purity bisphenol-A based solid epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and low volatile organic compound (VOC) content for environmentally compliant processing.
Superior adhesion to metals, glass fibers, and thermoset composites without requiring additional coupling agents.
Optimized melt viscosity for efficient handling in extrusion, powder coating, and filament winding applications.
Controlled epoxy equivalent weight (EEW) enabling precise stoichiometric formulation with common hardeners.
Electrical encapsulation and potting compounds for transformers, sensors, and PCB protection.
Powder coatings for automotive under-hood components and industrial metal substrates.
Prepreg systems in aerospace and wind turbine blade composite manufacturing.
Structural adhesives for high-performance bonding in transportation and construction sectors.
Electrophoretic deposition (EPD) coatings for corrosion-resistant metal finishing.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) epoxy resin |
| Product Form | Off-white to pale yellow solid flakes or pellets |
| Appearance | Free-flowing granular solid, homogeneous particle size |
| Epoxy Equivalent Weight (EEW) | 470–490 g/eq (ASTM D1652) |
| Melting Point | 85–92 °C (DSC method) |
| Gardner Color | ≤ 2 (10% w/w solution in methyl isobutyl ketone) |
| Softening Point | 88–94 °C (ring-and-ball, ASTM E28) |
| Volatiles Content | ≤ 0.3 wt% (105 °C, 2 h, ASTM D2571) |
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E-mail: wangxingqiang@ericwchem.com
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