High purity bisphenol A-based epoxy structure ensuring excellent chemical resistance and thermal stability.
Optimized molecular weight distribution for balanced viscosity and reactivity in processing.
Low chloride content (< 500 ppm) supporting high electrical insulation performance.
Consistent batch-to-batch reproducibility meeting stringent quality control standards.
Compatible with common amine, anhydride, and phenolic curing agents for versatile formulation design.
Electrical laminates for printed circuit boards (PCBs) requiring high Tg and dielectric integrity.
Encapsulants and potting compounds for power electronics and LED modules.
Structural adhesives in aerospace and automotive composite bonding.
High-performance coatings for industrial steel and marine infrastructure protection.
Matrix resin for fiber-reinforced composites in wind turbine blades and sporting goods.
| Chemical Type | Bisphenol A diglycidyl ether (DGEBA) epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free of gels or particulates |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 12,000–16,000 mPa·s |
| Chlorine Content | ≤ 500 ppm |
| Gardner Color | ≤ 3 |
| Volatile Matter | ≤ 0.3 wt% |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China