Enhances phase separation stability in organic-based thermal storage systems.
Reduces interfacial tension between paraffin-based PCM (phase change material) and aqueous or polymer matrix phases.
Improves long-term dispersion stability without compromising latent heat capacity.
Thermally stable up to 120°C, supporting processing in hot-melt formulation environments.
Non-ionic, low-foaming, and compatible with common polymer carriers and encapsulation resins.
Latent heat thermal energy storage composites for building envelope materials.
Microencapsulated phase change materials (micro-PCMs) for textiles and smart fabrics.
Thermally responsive coatings and plasters with regulated heat absorption/release.
PCM-integrated gypsum boards and cementitious thermal mass additives.
Heat management formulations in automotive cabin climate control systems.
| Chemical Type | Non-ionic surfactant blend (polyoxyethylene alkyl ether derivatives) |
| Product Form | Viscous liquid |
| Appearance | Pale yellow to amber clear liquid |
| pH (1% aqueous solution, 25°C) | 6.0–7.5 |
| Solubility | Miscible with common organic solvents; partially water-dispersible |
| Flash Point (COC) | ≥140°C |
| Storage Temperature Range | 5–30°C (store in sealed container, avoid freezing) |
| Primary Applications | Stabilization of paraffin-based PCMs in solid-liquid thermal storage matrices |
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