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Enhances thermal stability and long-term durability of thermoset resins.
Improves compatibility and dispersion in epoxy, phenolic, and polyurethane systems.
Offers low volatility and reduced migration risk in high-performance composites.
Provides excellent adhesion promotion between organic resins and inorganic fillers or fibers.
Enables formulation flexibility with adjustable hydroxyl functionality via alkylene oxide chain length.
Aerospace-grade composite matrices for structural components.
High-reliability encapsulants and underfill materials in semiconductor packaging.
Advanced wind turbine blade resins requiring fatigue resistance and moisture barrier performance.
Automotive under-hood thermoset composites exposed to elevated temperatures and chemical stress.
Electrical insulation systems for high-voltage transformers and bushings.
| Chemical Type | Bisphenol-A-based alkylene oxide (propylene oxide/ethylene oxide) adduct |
| Product Form | Viscous liquid to semi-solid resin (grade-dependent) |
| Appearance | Pale yellow to amber transparent liquid or flake |
| Hydroxyl Value | 180–240 mg KOH/g (typical range) |
| Acid Value | < 1.0 mg KOH/g |
| Softening Point | 45–75 °C (ring-and-ball method) |
| Primary Applications | Epoxy resin modification, high-performance composite matrices, electrical insulation |
| Key Features | Thermal stability enhancer, compatibility promoter, adhesion modifier |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
