Enhances thermal stability and phase-change efficiency in latent heat storage systems.
Improves dispersion and interfacial compatibility of polyimide-based PCM (Phase Change Material) composites.
Reduces surface tension without compromising high-temperature performance (>250 °C).
Enables uniform microencapsulation of PCMs for improved cycling durability and thermal reliability.
Compatible with aromatic polyimide precursors and solvent-based processing routes (e.g., NMP, DMAC).
Thermal management layers in aerospace composite structures.
High-performance PCM additives for electric vehicle battery thermal regulation systems.
Stabilizer for polyimide-PCM nanocomposites used in smart building envelope materials.
Interfacial modifier in flexible printed circuit board (FPCB) heat-dissipating films.
Functional additive in high-temperature thermal interface materials (TIMs) for power electronics.
| Chemical Type | Aromatic polyimide-derived nonionic surfactant |
| Product Form | Powder or free-flowing granules |
| Appearance | Light amber to pale brown solid |
| Solubility | Soluble in polar aprotic solvents (e.g., NMP, DMAC); dispersible in heated epoxy and polyimide precursor solutions |
| Thermal Decomposition Onset (TGA, N₂) | ≥320 °C |
| pH (1% aqueous dispersion, 25 °C) | 6.8–7.4 |
| Key Features | Low volatility, non-migrating, thermally stable surfactancy |
| Primary Applications | Thermal energy storage composites, high-temp functional coatings, advanced TIM formulations |
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E-mail: wangxingqiang@ericwchem.com
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