Highly effective, non-ionic antistatic performance for low-surface-resistivity substrates.
Excellent compatibility with polyolefins, ABS, PS, and engineering thermoplastics.
Thermally stable up to 260°C, suitable for high-temperature extrusion and injection molding processes.
Migration-controlled release mechanism ensures long-lasting antistatic effect without blooming or plate-out.
Compliant with FDA 21 CFR §178.2010 for indirect food contact applications (when used as directed).
Antistatic packaging films for electronics and semiconductor handling.
Injection-molded housings for medical devices and diagnostic equipment.
Extruded profiles and sheets for cleanroom and static-sensitive manufacturing environments.
Automotive interior components requiring ESD protection and aesthetic surface integrity.
3D printing filaments (e.g., ABS, PC blends) where static dissipation enhances powder handling and part reliability.
| Chemical Type | Non-ionic ethoxylated amide derivative |
| Product Form | Pellets (free-flowing, uniform size) |
| Appearance | Off-white to light tan solid pellets |
| Primary Applications | Polyolefin, ABS, PS, and PC-based thermoplastic compounds |
| Key Features | Low volatility, no amine odor, non-corrosive to processing equipment |
| Benefits | Reduces surface resistivity to 10⁹–10¹¹ Ω/sq; improves dust resistance and operator safety |
| Recommended Loading Level | 0.5–2.0 wt% depending on polymer matrix and performance requirements |
| Storage Conditions | Store in original sealed container at 15–30°C; protect from moisture and direct sunlight |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China