High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and cured polymer substrates.
Low viscosity (12,000–15,000 mPa·s at 25°C) enabling easy processing and deep impregnation.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good thermal stability with glass transition temperature (Tg) of 120–125°C after full cure.
Electrical encapsulation and potting of transformers, inductors, and power modules.
Structural bonding in aerospace composite assemblies and metal-to-composite joints.
Matrix resin for filament-wound pressure vessels and high-pressure composite tanks.
Coating and lining systems for corrosion-resistant industrial equipment and chemical storage tanks.
Advanced printed circuit board (PCB) laminates requiring high CTI and flame retardancy (UL94 V-0 compliant when formulated).
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free of visible gels or particles |
| Epoxy Equivalent Weight (EEW) | 188–192 g/eq |
| Viscosity (25°C) | 12,000–15,000 mPa·s |
| Chloride Content | ≤ 800 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability (25°C) | ≥ 12 months in sealed original container |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China