English
Español
tiếng việt
русский
High purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent compatibility with standard amine and anhydride curing agents for broad formulation flexibility.
Low viscosity (10,000–12,000 cP at 25°C) enabling easy handling, mixing, and impregnation of reinforcements.
Superior electrical insulation properties and low dielectric loss suitable for electronic encapsulation.
Good thermal stability with glass transition temperature (Tg) of cured system ≥125°C after post-cure.
Electrical and electronic encapsulants for transformers, reactors, and power modules.
High-voltage insulators and bushings requiring long-term tracking resistance.
Structural adhesives for aerospace and automotive composite bonding.
Prepregs and filament-wound components in wind turbine blade manufacturing.
Castings and potting compounds for industrial sensors and control units.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear to pale yellow liquid |
| Appearance | Transparent, homogeneous liquid without sediment or haze |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 10,000–12,000 cP |
| Chlorine Content (Total Cl) | ≤ 700 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability | Stable for ≥12 months at 25°C in sealed containers |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
