High purity bisphenol-A based liquid epoxy resin with consistent epoxide equivalent weight (EEW).
Excellent adhesion to metals, composites, and cured thermosets without requiring surface priming.
Low viscosity (< 12,000 cP at 25°C) enabling easy processing via casting, impregnation, and vacuum infusion.
Good thermal stability and low chloride content (< 500 ppm), supporting high-reliability electrical encapsulation.
Compatible with standard amine, anhydride, and catalytic curing agents for flexible formulation design.
Electrical insulation and potting of transformers, reactors, and medium-voltage switchgear.
Structural adhesive formulations for aerospace composite bonding and automotive metal-to-composite joints.
Matrix resin in filament-wound pressure vessels and pultruded profiles for industrial infrastructure.
Encapsulation of power electronics modules, including IGBTs and SiC-based devices.
High-performance coating base for corrosion-resistant linings in chemical process equipment.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear, pale yellow liquid |
| Appearance | Transparent, slightly viscous liquid, free from gels or suspended matter |
| Epoxide Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 10,000–12,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | 12–16°C |
| Primary Applications | Electrical encapsulation, structural adhesives, composite matrices, protective coatings |
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E-mail: wangxingqiang@ericwchem.com
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