High-purity bisphenol-A based liquid epoxy resin with low chlorine content.
Excellent thermal stability and chemical resistance, especially to alkalis and solvents.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing and good wetting of fillers/fibers.
Consistent molecular weight distribution ensuring reproducible curing behavior and mechanical performance.
Optimized for compatibility with standard amine and anhydride curing agents used in industrial formulations.
Electrical encapsulation and potting compounds for transformers and power modules.
High-performance composite matrices for aerospace and wind turbine blade laminates.
Structural adhesives requiring elevated temperature resistance and long-term durability.
Coating systems for corrosion protection in marine and offshore infrastructure.
Printed circuit board (PCB) laminates and prepreg formulations.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Pale yellow to water-white, transparent |
| Epoxy Equivalent Weight (EEW) | 187–193 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chlorine Content | ≤ 900 ppm |
| Softening Point | 12–16°C |
| Storage Stability | ≥ 12 months at 20–25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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