High reactivity with standard amine and anhydride hardeners for rapid cure at ambient or elevated temperatures.
Excellent electrical insulation properties with low dielectric loss and high volume resistivity.
Superior adhesion to metals, composites, and cured polymer substrates without surface priming.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing via casting, impregnation, and filament winding.
Good thermal stability with glass transition temperature (Tg) of 125–130°C after full cure with DDS hardener.
Electrical encapsulation of high-voltage transformers and bushings.
Structural bonding in aerospace composite assemblies requiring FAA-compliant fire performance.
Insulating varnish for rotating electrical machinery windings (motors and generators).
Matrix resin for carbon fiber prepregs used in lightweight structural components.
Underfill material for power electronics modules demanding thermal cycling resistance.
| Chemical Type | Diglycidyl ether of bisphenol-F (DGEBF) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Amber to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 168–174 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at ≤ 25°C in sealed containers |
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