High purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent compatibility with standard amine and anhydride curing agents for broad formulation flexibility.
Low viscosity (11,000–13,000 cP at 25°C) enabling easy handling, mixing, and processing in casting and coating applications.
Superior adhesion to metals, composites, and concrete substrates under ambient and elevated temperature conditions.
Good thermal stability and chemical resistance post-cure, especially against alkalis and mild solvents.
Electrical encapsulation and potting compounds for transformers, sensors, and power modules.
High-performance protective coatings for marine, offshore, and industrial steel structures.
Structural adhesive formulations requiring high shear strength and environmental durability.
Wind turbine blade bonding and repair resins in composite manufacturing.
Concrete repair mortars and anchoring systems in civil engineering projects.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Liquid |
| Appearance | Clear, pale yellow viscous liquid |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 11,000–13,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at <25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China