Low-viscosity liquid epoxy resin enabling excellent processability and easy handling in standard mixing and dispensing equipment.
High purity with low chloride content, supporting reliable electrical insulation performance and reduced risk of corrosion in sensitive electronics.
Consistent reactivity profile for predictable cure kinetics with common amine and anhydride hardeners.
Excellent adhesion to metals, composites, and cured polymer substrates across diverse environmental conditions.
Stable shelf life under recommended storage conditions (25 °C or below, tightly sealed container).
Electrical encapsulation and potting compounds for transformers, sensors, and power modules.
Structural adhesives for aerospace and automotive composite bonding.
High-performance coatings for corrosion protection on offshore and industrial steel structures.
Matrix resin in filament-wound pipes and pressure vessels requiring dimensional stability and chemical resistance.
Formulation base for specialty composites used in wind turbine blade root joints and lightning protection systems.
| Chemical Type | Bisphenol-A based diglycidyl ether epoxy resin |
| Product Form | Clear to pale yellow liquid |
| Appearance | Homogeneous, low-viscosity liquid at 25 °C |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25 °C | 12,000–16,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Encapsulation, structural adhesives, high-performance coatings, composite matrices |
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E-mail: wangxingqiang@ericwchem.com
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