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High reactivity with standard amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and treated plastics under ambient and elevated temperature conditions.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing, impregnation, and void-free casting.
Superior electrical insulation properties with high dielectric strength (>18 kV/mm) and volume resistivity (>1 × 10¹³ Ω·cm).
Good thermal stability with glass transition temperature (Tg) of 125–135°C after full cure with DDS.
Electrical encapsulation and potting of transformers, inductors, and high-voltage sensors.
Structural adhesive formulation for aerospace composite bonding and metal-to-composite joints.
Matrix resin for filament-wound pressure vessels and carbon fiber reinforced components.
Castable insulation systems for medium-voltage switchgear and busbar supports.
Underfill and glob-top materials in power electronics packaging requiring thermal and mechanical reliability.
| Chemical Type | Diglycidyl ether of bisphenol-F (DGEBF) |
| Product Form | Liquid resin |
| Appearance | Pale yellow to amber transparent liquid |
| Epoxy Equivalent Weight (EEW) | 168–174 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chloride Content | < 800 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at <25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
