English
Español
tiếng việt
русский
High-latency epoxy curing agent enabling extended pot life at ambient temperature.
Activates rapidly upon heating (typically >120 °C), ensuring precise processing control in thermal cure cycles.
Delivers excellent mechanical properties and thermal stability in cured epoxy resins.
Low volatility and minimal odor, supporting safer handling and improved workplace compliance.
Compatible with standard diglycidyl ether of bisphenol-A (DGEBA) and multifunctional epoxy resins.
Prepregs for aerospace and high-performance composites.
Electrical encapsulants and potting compounds for power electronics.
Structural adhesives requiring shelf-stable one-component formulation.
Coating systems for metal substrates demanding high crosslink density and chemical resistance.
3D printing resins where thermal-triggered polymerization enables layer-by-layer precision.
| Chemical Type | Modified imidazole derivative |
| Product Form | Powder |
| Appearance | Off-white to light yellow free-flowing powder |
| Primary Applications | Epoxy resin systems requiring latent thermal curing |
| Key Features | Latent reactivity, low-temperature storage stability, sharp activation profile |
| Recommended Cure Schedule | 150–180 °C for 30–60 minutes |
| Shelf Life (unopened, 25 °C) | 12 months |
| Handling Precautions | Avoid inhalation of dust; use in well-ventilated areas with appropriate PPE |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
