English
Español
tiếng việt
русский
Highly latent at room temperature—enables extended pot life and ambient storage stability.
Activates rapidly upon thermal triggering (typically >120°C), delivering efficient epoxy resin curing.
Halogen-free formulation compliant with RoHS and REACH regulatory requirements.
Excellent compatibility with standard bisphenol-A and novolac epoxy resins.
Low volatility and minimal odor—supports safer handling in industrial environments.
Electronics encapsulation and potting compounds for PCB protection.
Structural adhesives requiring delayed cure and precise process control.
Prepregs and composite laminates for aerospace and automotive components.
Coating systems demanding high crosslink density and chemical resistance.
3D printing resins where thermal-triggered, low-shrinkage polymerization is critical.
| Chemical Type | Latent imidazole derivative |
| Product Form | Powder |
| Appearance | White to off-white free-flowing powder |
| Primary Applications | Epoxy resin curing agent for high-performance composites and electronics |
| Key Features | Thermally activated, halogen-free, low volatility |
| Storage Conditions | Store sealed under dry conditions at 5–30°C |
| Solubility | Soluble in common epoxy diluents (e.g., DGEBA, phenyl glycidyl ether) |
| Onset Activation Temperature | Approx. 120°C (DSC, 10°C/min) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
