High purity bisphenol A-based epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and chemical resistance, particularly to alkalis and solvents.
Low chlorine content (< 800 ppm), supporting compliance with stringent electronics and coating standards.
Optimized viscosity for ease of processing in solvent-free and high-solids formulations.
Superior adhesion to metals, glass, and composite substrates after proper curing.
Electrical encapsulation and potting compounds for transformers and power modules.
High-performance protective coatings for marine and industrial steel structures.
Prepregs and laminates in printed circuit board (PCB) manufacturing.
Structural adhesives for aerospace and automotive composite bonding.
Wind turbine blade matrix resins requiring long pot life and low exotherm.
| Chemical Type | Bisphenol A diglycidyl ether epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gel particles or sediment |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12,000–16,000 mPa·s |
| Chlorine Content | ≤ 800 ppm |
| Softening Point | 12–16°C |
| Volatiles Content | ≤ 0.3 wt% |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China