Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

CCP BE188 Bisphenol A Epoxy Resin

CCP BE188 is a high-purity bisphenol A-based epoxy resin from CCP’s BE series, offering excellent adhesion, chemical resistance and electrical insulation. Widely used in coatings, composites and electronic encapsulation, it features low viscosity, good reactivity with amines/anhydrides and consistent batch-to-batch performance. Ideal for demanding industrial applications requiring reliability and process efficiency.
  • ccp be188 bisphenol a epoxy resin_7644ac5c
  • ccp be188 bisphenol a epoxy resin_7644ac5c

Features Of CCP BE188 Bisphenol A Epoxy Resin

  1. High purity bisphenol A-based epoxy resin with consistent molecular weight distribution.

  2. Excellent thermal stability and chemical resistance, particularly to alkalis and solvents.

  3. Low chlorine content (< 800 ppm), supporting compliance with stringent electronics and coating standards.

  4. Optimized viscosity for ease of processing in solvent-free and high-solids formulations.

  5. Superior adhesion to metals, glass, and composite substrates after proper curing.

Typical Applications Of CCP BE188 Bisphenol A Epoxy Resin

  1. Electrical encapsulation and potting compounds for transformers and power modules.

  2. High-performance protective coatings for marine and industrial steel structures.

  3. Prepregs and laminates in printed circuit board (PCB) manufacturing.

  4. Structural adhesives for aerospace and automotive composite bonding.

  5. Wind turbine blade matrix resins requiring long pot life and low exotherm.

Specifications Of CCP BE188 Bisphenol A Epoxy Resin

Chemical TypeBisphenol A diglycidyl ether epoxy resin
Product FormClear to pale yellow viscous liquid
AppearanceHomogeneous, transparent, free from gel particles or sediment
Epoxy Equivalent Weight (EEW)185–192 g/eq
Viscosity at 25°C12,000–16,000 mPa·s
Chlorine Content≤ 800 ppm
Softening Point12–16°C
Volatiles Content≤ 0.3 wt%


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