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High reactivity with standard bisphenol-A and bisphenol-F epoxy resins at ambient to moderate elevated temperatures.
Excellent chemical resistance post-cure, including resistance to alkalis, solvents, and mild acids.
Low viscosity formulation enabling easy handling, precise metering, and improved filler dispersion.
Good thermal stability with glass transition temperature (Tg) exceeding 120 °C in cured systems.
Low volatility and non-hazardous classification under standard transport regulations (UN3082).
Electrical encapsulation and potting compounds for transformers, reactors, and power modules.
High-performance structural adhesives in automotive and rail transportation assemblies.
Coating systems for corrosion protection of steel substrates in marine and industrial environments.
Composite matrix resin for filament-wound pressure vessels and wind turbine blade components.
Underfill and conformal coating formulations in electronics packaging and PCB protection.
| Chemical Type | Amine-based aliphatic polyamine adduct |
| Product Form | Liquid |
| Appearance | Pale yellow to amber clear liquid |
| Specific Gravity (25 °C) | 0.94–0.97 g/cm³ |
| Viscosity (25 °C) | 250–400 mPa·s |
| Amine Value | 380–420 mg KOH/g |
| Flash Point (COC) | ≥120 °C |
| Storage Stability | ≥12 months at 5–30 °C in sealed original container |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
