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Halogen-free flame retardant formulation compliant with IEC 61249-2-21 and RoHS 2.0 directives.
Excellent thermal stability up to 280°C, supporting lead-free soldering processes without degradation.
Low ionic impurity content (<5 µg/g Cl⁻, <2 µg/g Br⁻), minimizing risk of electrochemical migration in high-reliability PCBs.
Optimized viscosity profile for precise dispensing and uniform coverage on copper-clad laminates (CCL).
Maintains strong adhesion to FR-4, polyimide, and high-Tg epoxy substrates after thermal cycling (-40°C to +125°C).
Flame-retardant bonding layer in multilayer printed circuit boards (PCBs) for automotive electronics.
Adhesive interlayer in high-frequency CCL used in 5G base station RF modules.
Thermal interface and flame-barrier adhesive for power module substrates in EV inverters.
Fire-safe lamination adhesive for flexible-rigid hybrid PCBs in medical imaging equipment.
UL 94 V-0 rated bonding solution for consumer electronics requiring stringent safety certification.
| Chemical Type | Phosphorus-based reactive flame retardant epoxy system |
| Product Form | Two-component liquid adhesive (Part A: resin, Part B: hardener) |
| Appearance | Amber translucent liquid (Part A); pale yellow liquid (Part B) |
| Primary Applications | Copper-clad laminate (CCL) bonding, PCB lamination, fire-safe electronic encapsulation |
| Key Features | Halogen-free, UL 94 V-0 rated (1.6 mm thickness), Tg ≥ 175°C (DSC) |
| Benefits | Enables high-CTE compatibility with copper foil, low outgassing (ASTM E595: TML <0.5%, CVCM <0.1%) |
| Storage Conditions | 25°C in sealed containers; Part A stable for 12 months, Part B stable for 6 months |
| Processing Cure Profile | 120°C × 60 min or 150°C × 30 min (post-cure recommended for full property development) |
Q1: What is the primary function of Deflamer LFR-8002 in electronic adhesive formulations?
A: Deflamer LFR-8002 is a halogen-free flame retardant specifically engineered to enhance the fire safety performance of copper-clad laminate (CCL) adhesives and related electronic bonding materials, helping formulations meet stringent UL 94 V-0 or V-1 classifications without compromising electrical insulation or thermal stability.
Q2: Is Deflamer LFR-8002 compatible with common epoxy and phenolic resin systems used in CCL manufacturing?
A: Yes — it demonstrates excellent compatibility with standard epoxy, phenolic, and cyanate ester-based adhesive matrices. It disperses uniformly during mixing and does not induce premature gelation or significant viscosity drift under typical processing conditions.
Q3: How does Deflamer LFR-8002 affect the mechanical and electrical properties of cured adhesives?
A: When incorporated at recommended loadings, it maintains high glass transition temperature (Tg), low dielectric constant (Dk), and low dissipation factor (Df), supporting high-frequency PCB performance. No significant reduction in peel strength or thermal shock resistance has been observed in validated CCL applications.
Q4: What is the typical dosage range for Deflamer LFR-8002 in electronic adhesive formulations?
A: Dosage depends on the base resin system and target flame-retardant performance, but it is typically used at low concentrations — generally ranging from 0.1% to 2% by weight — to achieve effective flame inhibition while preserving processability and end-use reliability.
Q5: Does Deflamer LFR-8002 generate corrosive gases or smoke during thermal decomposition?
A: As a phosphorus-nitrogen synergistic, halogen-free additive, it promotes char formation and suppresses both smoke density and the release of acidic or corrosive decomposition products — making it suitable for enclosed electronic assemblies where corrosion sensitivity is critical.
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