English
Español
tiếng việt
русский
Halogen-free flame retardant formulation compliant with IEC 61249-2-21 and RoHS 2.0 directives.
Excellent thermal stability up to 280°C, supporting lead-free soldering processes without degradation.
Low ionic impurity content (<5 µg/g Cl⁻, <2 µg/g Br⁻), minimizing risk of electrochemical migration in high-reliability PCBs.
Optimized viscosity profile for precise dispensing and uniform coverage on copper-clad laminates (CCL).
Maintains strong adhesion to FR-4, polyimide, and high-Tg epoxy substrates after thermal cycling (-40°C to +125°C).
Flame-retardant bonding layer in multilayer printed circuit boards (PCBs) for automotive electronics.
Adhesive interlayer in high-frequency CCL used in 5G base station RF modules.
Thermal interface and flame-barrier adhesive for power module substrates in EV inverters.
Fire-safe lamination adhesive for flexible-rigid hybrid PCBs in medical imaging equipment.
UL 94 V-0 rated bonding solution for consumer electronics requiring stringent safety certification.
| Chemical Type | Phosphorus-based reactive flame retardant epoxy system |
| Product Form | Two-component liquid adhesive (Part A: resin, Part B: hardener) |
| Appearance | Amber translucent liquid (Part A); pale yellow liquid (Part B) |
| Primary Applications | Copper-clad laminate (CCL) bonding, PCB lamination, fire-safe electronic encapsulation |
| Key Features | Halogen-free, UL 94 V-0 rated (1.6 mm thickness), Tg ≥ 175°C (DSC) |
| Benefits | Enables high-CTE compatibility with copper foil, low outgassing (ASTM E595: TML <0.5%, CVCM <0.1%) |
| Storage Conditions | 25°C in sealed containers; Part A stable for 12 months, Part B stable for 6 months |
| Processing Cure Profile | 120°C × 60 min or 150°C × 30 min (post-cure recommended for full property development) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
