Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow BIOBAN IPBC 40 LE Biocide

Dow BIOBAN IPBC 40 LE Biocide is a low-emission, broad-spectrum isothiazolinone-based preservative from Dow’s BIOBAN series. It delivers effective microbial control in water-based coatings, adhesives, and construction materials while meeting stringent VOC and regulatory requirements for sustainable formulations.
  • dow bioban ipbc 40 le biocide_d64479de
  • dow bioban ipbc 40 le biocide_d64479de

Features Of Dow BIOBAN IPBC 40 LE Biocide

  1. Broad-spectrum antimicrobial efficacy against bacteria, fungi, and algae.

  2. Low-volatility liquid emulsion formulation for enhanced stability and handling safety.

  3. Compatible with a wide range of water-based industrial formulations including paints, coatings, and adhesives.

  4. Regulatory-compliant biocide approved for use in multiple global markets under relevant biocidal product regulations.

  5. Effective at low use concentrations, supporting cost-efficient preservation without compromising performance.

Typical Applications Of Dow BIOBAN IPBC 40 LE Biocide

  1. Preservation of architectural and industrial water-based paints and coatings.

  2. Antimicrobial protection in latex-based adhesives and sealants.

  3. Stabilization of aqueous polymer dispersions and emulsions.

  4. Protection of construction chemicals such as grouts, mortars, and tile adhesives.

  5. Preservation of nonwovens and textile finishing baths.

Specifications Of Dow BIOBAN IPBC 40 LE Biocide

Chemical TypeIodopropynyl butylcarbamate (IPBC)
Product FormStable aqueous emulsion
AppearanceOpaque white to off-white liquid
Active Ingredient ContentApprox. 40 wt% IPBC
pH (1% aqueous solution)6.5 – 8.5
Density (20 °C)1.02 – 1.06 g/cm³
SolubilityInsoluble in water; forms stable oil-in-water emulsion
Storage Stability≥12 months at 5–25 °C in original sealed container


Get in Touch with ERICW
Let competitive chemical materials go global.

Your Name *

Your Email *

Your Phone

Country

Your Message *