High molecular weight solid epoxy resin with excellent thermal stability and low melt viscosity.
Offers superior chemical resistance, particularly to alkalis and solvents, after proper curing.
Provides outstanding adhesion to metals, composites, and cured thermoset substrates.
Enables formulation flexibility for solvent-free or low-VOC coating and composite systems.
Consistent batch-to-batch performance supported by rigorous Dow quality control protocols.
High-performance powder coatings for architectural aluminum and industrial metal substrates.
Matrix resin in carbon fiber and glass fiber reinforced composites for aerospace and wind energy components.
Electrical encapsulation and potting compounds requiring high dielectric strength and thermal endurance.
Structural adhesives for automotive and transportation bonding applications.
Prepregs and filament-wound parts demanding dimensional stability under elevated temperature cycling.
| Chemical Type | Bisphenol-A based solid epoxy resin |
| Product Form | Pale yellow to amber solid flakes or pellets |
| Appearance | Free-flowing, non-dusty granular solid |
| Epoxy Equivalent Weight (EEW) | 475–495 g/eq |
| Melt Viscosity (150°C) | 8,000–12,000 cP |
| Softening Point | 82–88°C (ASTM E28) |
| Volatiles Content | <0.3 wt% (105°C, 2 hrs) |
| Chlorine Content | <800 ppm (total chlorine) |
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E-mail: wangxingqiang@ericwchem.com
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