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Low-viscosity liquid epoxy resin enabling excellent processability and ease of handling in solvent-free formulations.
High purity with low chloride content, supporting superior electrical insulation properties and long-term reliability.
Excellent compatibility with standard amine and anhydride curing agents for broad formulation flexibility.
Good adhesion to metals, glass, and composites—ideal for demanding structural bonding applications.
Thermal stability suitable for elevated-temperature cure cycles and service environments up to 120 °C.
Electrical encapsulation and potting compounds for transformers, reactors, and high-voltage insulators.
Structural adhesives in aerospace and transportation for bonding composite-to-metal assemblies.
Matrix resin in filament-wound pressure vessels and composite piping systems.
High-performance coatings for corrosion protection in marine and industrial infrastructure.
Prepregs and infusion resins for wind turbine blade manufacturing.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear to pale yellow low-viscosity liquid |
| Appearance | Transparent, slightly viscous liquid at 25 °C |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25 °C) | 12–16 Pa·s (12,000–16,000 cP) |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Encapsulation, structural adhesives, composites, high-voltage insulation |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
