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High-solids, solvent-based silicone resin offering excellent thermal stability up to 250 °C continuous use.
Provides superior electrical insulation properties with low dielectric loss and high volume resistivity.
Forms durable, flexible, and crack-resistant films upon solvent evaporation and thermal cure.
Compatible with common organic resins (e.g., epoxy, polyester) for hybrid formulation flexibility.
Low volatility and minimal outgassing after curing — suitable for demanding electronic and aerospace applications.
Insulating varnishes for electric motors, transformers, and generators.
Protective coatings for high-temperature wire enamels and magnet wires.
Binders in high-performance abrasive wheels and refractory composites.
Matrix resins in lightweight thermal barrier and EMI shielding composites.
Surface treatments for glass fiber fabrics used in aerospace and industrial filtration.
| Chemical Type | Methyl-phenyl silicone resin |
| Product Form | Solvent solution (xylene/toluene blend) |
| Appearance | Clear, colorless to pale yellow liquid |
| Solids Content | 55–60 wt% (as received) |
| Viscosity (25 °C) | 800–1,200 cP (Brookfield, spindle #3, 20 rpm) |
| Density (25 °C) | 0.92–0.95 g/cm³ |
| Flash Point (Tag Closed Cup) | 38–42 °C |
| Cure Profile | 150 °C × 30 min or 200 °C × 10 min (film formation) |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
