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Two-part, platinum-catalyzed addition-cure silicone elastomer system offering excellent flow and self-leveling behavior.
Low viscosity before cure enables easy dispensing, precise metering, and thorough encapsulation of delicate electronic components.
Fast room-temperature or elevated-temperature cure with minimal shrinkage and outstanding dimensional stability.
Exceptional thermal stability, maintaining mechanical integrity from –55 °C to +200 °C after full cure.
UL 94 V-0 rated (per ASTM D3801), providing inherent flame retardancy without halogenated additives.
Encapsulation and potting of power electronics, including IGBT modules and EV battery management systems.
Thermal interface material (TIM) bonding for heat sinks, LED drivers, and high-power semiconductor assemblies.
Protective conformal coating and stress-relieving underfill for automotive ADAS sensors and engine control units.
Dielectric insulation and environmental sealing in renewable energy inverters and solar microinverters.
High-reliability bonding and gap-filling in aerospace avionics housings requiring long-term thermal cycling resistance.
| Chemical Type | Platinum-catalyzed addition-cure silicone elastomer |
| Product Form | Two-component liquid kit (Part A and Part B) |
| Appearance (Uncured) | Part A: Translucent, low-viscosity liquid; Part B: Translucent, low-viscosity liquid |
| Base Polymer | Dimethylvinylsiloxy-terminated polydimethylsiloxane |
| Cure Mechanism | Hydrosilylation (Si–H + Si–Vinyl) |
| Shore A Hardness (7 days @ 25 °C) | 45 ± 3 |
| Tensile Strength (ASTM D412) | 5.0 MPa typical |
| Volume Resistivity (ASTM D257) | >1 × 10¹⁵ Ω·cm |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
