Two-part, platinum-catalyzed addition-cure silicone elastomer system offering excellent flow and self-leveling behavior.
Low viscosity before cure enables easy dispensing, precise metering, and thorough encapsulation of delicate electronic components.
Fast room-temperature or elevated-temperature cure with minimal shrinkage and outstanding dimensional stability.
Exceptional thermal stability, maintaining mechanical integrity from –55 °C to +200 °C after full cure.
UL 94 V-0 rated (per ASTM D3801), providing inherent flame retardancy without halogenated additives.
Encapsulation and potting of power electronics, including IGBT modules and EV battery management systems.
Thermal interface material (TIM) bonding for heat sinks, LED drivers, and high-power semiconductor assemblies.
Protective conformal coating and stress-relieving underfill for automotive ADAS sensors and engine control units.
Dielectric insulation and environmental sealing in renewable energy inverters and solar microinverters.
High-reliability bonding and gap-filling in aerospace avionics housings requiring long-term thermal cycling resistance.
| Chemical Type | Platinum-catalyzed addition-cure silicone elastomer |
| Product Form | Two-component liquid kit (Part A and Part B) |
| Appearance (Uncured) | Part A: Translucent, low-viscosity liquid; Part B: Translucent, low-viscosity liquid |
| Base Polymer | Dimethylvinylsiloxy-terminated polydimethylsiloxane |
| Cure Mechanism | Hydrosilylation (Si–H + Si–Vinyl) |
| Shore A Hardness (7 days @ 25 °C) | 45 ± 3 |
| Tensile Strength (ASTM D412) | 5.0 MPa typical |
| Volume Resistivity (ASTM D257) | >1 × 10¹⁵ Ω·cm |
Q1: What is the typical mixing ratio of Part A to Part B?
A: Dow DOWSIL TC-4605 is supplied as a two-component kit with a fixed 1:1 volumetric mixing ratio. Accurate metering and thorough mixing are essential to achieve full cure and optimal elastomeric performance.
Q2: How does humidity affect the curing process?
A: As a condensation-cure silicone elastomer, TC-4605 relies on ambient moisture for crosslinking. Curing speed increases with higher relative humidity and temperature, while low-humidity or cold environments may extend surface tack time and overall cure duration.
Q3: Can TC-4605 be used for applications requiring electrical insulation?
A: Yes — once fully cured, TC-4605 forms a flexible, hydrophobic silicone elastomer with excellent dielectric properties and stable electrical resistance across a wide temperature and frequency range, making it suitable for protective encapsulation and potting in electronic assemblies.
Q4: Is post-cure required to achieve final properties?
A: Post-cure is not mandatory but is recommended for applications demanding maximum thermal stability, mechanical consistency, or low volatile content. A mild thermal post-cure (e.g., 60–80 °C for 2–4 hours) can enhance crosslink density and reduce residual by-products.
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