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High reactivity with standard bisphenol-A and bisphenol-F epoxy resins.
Enables fast ambient-cure or low-bake formulations without sacrificing pot life.
Delivers excellent chemical resistance and mechanical performance in cured networks.
Low viscosity for easy handling, metering, and homogeneous blending.
Halogen-free formulation supporting sustainability and regulatory compliance.
Electrical encapsulation and potting compounds for power electronics.
High-performance adhesives for automotive structural bonding.
Coatings for corrosion protection of industrial steel substrates.
Composite matrix resins in wind blade and aerospace tooling applications.
Underfill and conformal coating materials for PCB protection.
| Chemical Type | Amine-based aliphatic curing agent |
| Product Form | Liquid |
| Appearance | Pale yellow to colorless transparent liquid |
| Primary Applications | Encapsulation, adhesives, coatings, composites |
| Key Features | Fast cure, low viscosity, halogen-free |
| Benefits | Improved productivity, enhanced durability, RoHS-compliant |
| Storage Stability | At least 12 months at 20–25 °C in original sealed container |
| Handling Precautions | Use in well-ventilated areas; avoid skin contact and inhalation of mists |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
