English
Español
tiếng việt
русский
High reactivity with standard bisphenol-A and bisphenol-F epoxy resins.
Enables fast ambient-cure formulations without external heat input.
Delivers excellent chemical resistance, particularly to alkalis and solvents.
Low viscosity improves processability and facilitates easy mixing and degassing.
Provides superior adhesion to metals, composites, and concrete substrates.
Industrial flooring systems requiring rapid return-to-service.
Structural adhesives for automotive and aerospace assembly.
Protective coatings for offshore and marine infrastructure.
Electrical encapsulation and potting compounds for high-reliability electronics.
Repair mortars and grouts in civil engineering applications.
| Chemical Type | Aliphatic amine adduct |
| Product Form | Liquid |
| Appearance | Pale yellow to amber clear liquid |
| Density (20 °C) | ~0.95–0.98 g/cm³ |
| Viscosity (25 °C) | 200–400 mPa·s |
| Amine Value | 320–360 mg KOH/g |
| Reactivity Profile | Fast ambient cure, gel time < 30 min at 23 °C (1:1 w/w with DGEBA) |
| Primary Applications | High-performance structural adhesives, protective coatings, flooring, electrical encapsulation |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
