Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

GECN704 Epoxy Resin

GECN704EpoxyResinisahigh-performancebisphenol-A-basedepoxyresinfromGECNSeriesofferingexcellentadhesion,chemicalresistance,andmechanicalstrength.Idealforcomposites,coatings,andelectricalinsulationwithlowviscosityandgoodcuringreactivity.
  • gecn704 epoxy resin_fc97f849
  • gecn704 epoxy resin_fc97f849

Features Of GECN704 Epoxy Resin

  1. High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.

  2. Excellent adhesion to metals, composites, and treated plastics without primer requirement.

  3. Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing and deep impregnation.

  4. Superior electrical insulation properties with high dielectric strength (>18 kV/mm).

  5. Good thermal stability with glass transition temperature (Tg) of 125–130°C after full cure.

Typical Applications Of GECN704 Epoxy Resin

  1. Electrical encapsulation and potting of transformers, inductors, and power modules.

  2. Structural adhesive formulation for aerospace composite bonding and metal-to-composite joints.

  3. High-performance laminating resin for printed circuit board (PCB) prepregs and copper-clad laminates.

  4. Wind turbine blade root end and shear web bonding in renewable energy applications.

  5. Underfill and glob-top encapsulation for semiconductor packaging and MEMS devices.

Specifications Of GECN704 Epoxy Resin

Chemical TypeDiglycidyl ether of bisphenol-F (DGEBF)
Product FormClear, low-viscosity liquid
AppearanceAmber to pale yellow transparent liquid
Epoxy Equivalent Weight (EEW)175–185 g/eq
Viscosity (25°C)12,000–15,000 cP
Chloride Content≤ 500 ppm
Softening PointNot applicable (liquid at room temperature)
Storage Stability12 months at <25°C in sealed container


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