High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and treated plastics without primer requirement.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing and deep impregnation.
Superior electrical insulation properties with high dielectric strength (>18 kV/mm).
Good thermal stability with glass transition temperature (Tg) of 125–130°C after full cure.
Electrical encapsulation and potting of transformers, inductors, and power modules.
Structural adhesive formulation for aerospace composite bonding and metal-to-composite joints.
High-performance laminating resin for printed circuit board (PCB) prepregs and copper-clad laminates.
Wind turbine blade root end and shear web bonding in renewable energy applications.
Underfill and glob-top encapsulation for semiconductor packaging and MEMS devices.
| Chemical Type | Diglycidyl ether of bisphenol-F (DGEBF) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Amber to pale yellow transparent liquid |
| Epoxy Equivalent Weight (EEW) | 175–185 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at <25°C in sealed container |
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E-mail: wangxingqiang@ericwchem.com
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