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Low viscosity liquid epoxy resin enabling excellent processability and easy handling in mixing and dispensing operations.
High purity with low chlorine content, supporting superior electrical insulation properties and long-term reliability.
Consistent reactivity profile optimized for compatibility with common amine and anhydride curing agents.
Excellent adhesion to metals, composites, and cured polymer substrates without requiring aggressive surface pretreatment.
Good thermal stability and hydrolytic resistance, contributing to robust performance in demanding environments.
Electrical encapsulation and potting of transformers, sensors, and power electronics modules.
Structural adhesives for aerospace and automotive bonding applications requiring high strength and temperature resistance.
Matrix resin for filament-wound composites and pultruded profiles in industrial and infrastructure applications.
Coating systems for corrosion protection of steel pipelines and offshore equipment.
Formulation base for high-performance composite tooling and mold-making resins.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear, pale yellow liquid |
| Appearance | Homogeneous, low-viscosity liquid at 25°C |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12,000–16,000 cP |
| Chloride Content | ≤ 800 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Encapsulation, adhesives, composites, protective coatings |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
