English
Español
tiếng việt
русский
Low-viscosity liquid amide curing agent enabling excellent flow and wetting in epoxy systems.
Provides extended working time (pot life) at ambient temperatures while delivering rapid cure development upon heat activation.
Delivers high glass transition temperature (Tg) and superior mechanical properties in cured epoxy formulations.
Offers excellent chemical resistance, particularly to solvents, alkalis, and moderate acids.
Compatible with standard DGEBA-type epoxy resins and suitable for both room-temperature and elevated-temperature cure schedules.
Structural adhesives for aerospace and transportation bonding applications.
High-performance composites in wind turbine blade manufacturing.
Electrical encapsulation and potting compounds for power electronics and transformers.
Coatings and linings for industrial flooring and corrosion-resistant tank linings.
Tooling and casting resins requiring dimensional stability and low exotherm.
| Chemical Type | Aliphatic polyamide |
| Product Form | Low-viscosity liquid |
| Appearance | Amber to light brown transparent liquid |
| Primary Applications | Structural adhesives, composites, electrical encapsulation, protective coatings |
| Key Features | Extended pot life, high Tg, low exotherm, good compatibility with DGEBA resins |
| Benefits | Improved processing window, enhanced thermal and mechanical performance, reliable interfacial adhesion |
| Storage Conditions | Store in original unopened containers at 15–25°C; protect from moisture and freezing |
Q1: What is the primary function of EPIKURE 3072 in epoxy systems?
A: EPIKURE 3072 is a low-viscosity, amide-based curing agent designed to provide efficient room-temperature or elevated-temperature cure of standard liquid epoxy resins, delivering good chemical resistance, flexibility, and adhesion without requiring high-temperature post-cure.
Q2: Is EPIKURE 3072 suitable for applications requiring low exotherm and extended working time?
A: Yes — due to its moderate reactivity and amide chemistry, EPIKURE 3072 offers a longer pot life compared to highly reactive amines, making it well-suited for larger castings, thick-section coatings, and manual mixing applications where controlled heat generation is critical.
Q3: How does EPIKURE 3072 compare to traditional polyamide curing agents in terms of compatibility and performance?
A: Unlike conventional polyamides, EPIKURE 3072 offers improved clarity, lower viscosity, and more consistent batch-to-batch performance. It provides enhanced compatibility with a broad range of bisphenol-A and bisphenol-F epoxy resins, often yielding smoother surface finishes and reduced phase separation risk.
Q4: Can EPIKURE 3072 be used in moisture-sensitive or high-humidity environments?
A: While EPIKURE 3072 exhibits better moisture tolerance than many aliphatic amines, it is still susceptible to surface blushing or amine carbamation under high humidity. For optimal results, application should occur under controlled ambient conditions, and substrate moisture content should be minimized prior to use.
Q5: What types of formulations commonly incorporate EPIKURE 3072?
A: It is frequently selected for industrial maintenance coatings, electrical encapsulants, adhesive formulations, and repair mortars — especially where balanced toughness, low shrinkage, and ease of handling are prioritized over ultra-rapid cure or maximum thermal stability.
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
