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Low-viscosity liquid amide curing agent enabling excellent flow and wetting in epoxy systems.
Provides extended working time (pot life) at ambient temperatures while delivering rapid cure development upon heat activation.
Delivers high glass transition temperature (Tg) and superior mechanical properties in cured epoxy formulations.
Offers excellent chemical resistance, particularly to solvents, alkalis, and moderate acids.
Compatible with standard DGEBA-type epoxy resins and suitable for both room-temperature and elevated-temperature cure schedules.
Structural adhesives for aerospace and transportation bonding applications.
High-performance composites in wind turbine blade manufacturing.
Electrical encapsulation and potting compounds for power electronics and transformers.
Coatings and linings for industrial flooring and corrosion-resistant tank linings.
Tooling and casting resins requiring dimensional stability and low exotherm.
| Chemical Type | Aliphatic polyamide |
| Product Form | Low-viscosity liquid |
| Appearance | Amber to light brown transparent liquid |
| Primary Applications | Structural adhesives, composites, electrical encapsulation, protective coatings |
| Key Features | Extended pot life, high Tg, low exotherm, good compatibility with DGEBA resins |
| Benefits | Improved processing window, enhanced thermal and mechanical performance, reliable interfacial adhesion |
| Storage Conditions | Store in original unopened containers at 15–25°C; protect from moisture and freezing |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
