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Low-viscosity polyamide curing agent enabling excellent flow and wet-out in epoxy systems.
Provides balanced pot life and rapid ambient-cure performance for efficient production cycles.
Delivers superior flexibility and impact resistance in cured epoxy coatings and adhesives.
Exhibits good chemical resistance, particularly to alkalis and solvents, in protective coating applications.
Compatible with standard bisphenol-A and bisphenol-F epoxy resins without requiring solvent dilution.
Industrial maintenance coatings for steel structures and concrete surfaces.
High-performance flooring systems in warehouses, pharmaceutical facilities, and food processing plants.
Structural adhesives for metal-to-metal and composite bonding in transportation equipment.
Electrical encapsulation and potting compounds requiring low exotherm and dimensional stability.
Marine and offshore protective coatings exposed to humid and saline environments.
| Chemical Type | Polyamide adduct |
| Product Form | Liquid |
| Appearance | Amber to brown viscous liquid |
| Primary Applications | Epoxy coatings, adhesives, and flooring systems |
| Key Features | Ambient-curing, low viscosity, flexible cure film |
| Benefits | Good toughness, moisture tolerance, and substrate adhesion |
| Storage Stability | 12 months at 20–25°C in unopened original container |
| Recommended Mix Ratio (by weight) | 100 parts epoxy resin : 40–50 parts EPIKURE 3115A |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
