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Low-viscosity liquid formulation for easy handling and homogeneous mixing with epoxy resins.
Room-temperature curing capability with rapid gel time and full cure within 24–48 hours.
Excellent adhesion to metals, composites, and concrete substrates without primer requirement.
Low exotherm profile ensuring minimal thermal stress in thick-section castings and encapsulations.
Compliant with REACH and RoHS directives; contains no added solvents or heavy-metal catalysts.
Electrical insulation and potting of transformers, reactors, and high-voltage components.
Structural adhesive bonding in wind turbine blade assembly and automotive composite parts.
Protective coating and lining for chemical storage tanks and corrosion-prone industrial equipment.
Encapsulation of sensors, PCBs, and aerospace electronic modules requiring thermal and moisture resistance.
Repair mortars and anchoring systems for civil engineering infrastructure projects.
| Chemical Type | Aliphatic polyamine adduct |
| Product Form | Clear to pale yellow liquid |
| Appearance | Homogeneous, low-viscosity liquid |
| Density (25°C) | 0.96–0.98 g/cm³ |
| Amine Value | 210–230 mg KOH/g |
| Reactivity (with DGEBA epoxy) | Gel time: 45–60 min at 25°C |
| Primary Applications | Epoxy resin curing for electrical, structural, and protective applications |
| Storage Stability | 12 months unopened at 15–25°C |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
