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Low-viscosity liquid formulation enabling excellent mixing and processing with standard epoxy resins.
Fast-reacting amine-based chemistry delivering rapid gel time and early strength development at ambient temperatures.
Excellent adhesion to diverse substrates including metals, concrete, and composites.
Good chemical resistance post-cure, particularly against alkalis, solvents, and mild acids.
Low volatility and reduced odor profile compared to conventional aliphatic amines, improving workplace safety.
Structural adhesives for automotive and transportation assembly.
High-performance flooring and industrial coatings systems.
Electrical encapsulation and potting compounds for electronic components.
Repair mortars and anchoring grouts in construction and infrastructure projects.
Composite matrix formulations for wind blade and marine applications.
| Chemical Type | Aliphatic polyamine adduct |
| Product Form | Liquid |
| Appearance | Pale yellow to amber clear liquid |
| Density (25°C) | 0.92–0.96 g/cm³ |
| Viscosity (25°C) | 150–300 mPa·s |
| Amine Value | 380–420 mg KOH/g |
| Reactivity Profile | Ambient-curing, exothermic peak ~70–90°C |
| Storage Stability | 12 months unopened at 5–25°C |
Q1: What type of epoxy systems is SM208 designed for?
A: SM208 is a latent, dicyandiamide (DICY)-based curing agent formulated primarily for one-component (1K) thermosetting epoxy resins, especially in powder coatings, adhesives, and electrical encapsulation applications requiring extended shelf life and controlled high-temperature cure.
Q2: What is the typical activation temperature range for SM208?
A: SM208 exhibits latent behavior at room temperature and begins active crosslinking typically above 140 °C, with full cure generally achieved between 160 °C and 180 °C depending on formulation, film thickness, and dwell time.
Q3: How should SM208 be dispersed into epoxy resin?
A: For optimal homogeneity and stability, SM208 should be dry-blended with solid epoxy resins under low-shear conditions or pre-dispersed using high-speed mixing—avoid prolonged high-temperature processing prior to curing to preserve latency.
Q4: Is SM208 compatible with common epoxy accelerators?
A: Yes—SM208 is commonly used with imidazole-type or urea-based accelerators to fine-tune onset temperature and cure speed; however, accelerator selection and dosage must be optimized empirically to avoid compromising storage stability.
Q5: Does SM208 require special handling or safety precautions?
A: As with most fine organic powders, appropriate industrial hygiene practices are recommended—including dust control during handling, use of PPE such as gloves and respirators, and avoidance of inhalation or prolonged skin contact. Refer to the current Safety Data Sheet for detailed guidance.
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E-mail: wangxingqiang@ericwchem.com
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