High-purity bisphenol-A based liquid epoxy resin with low chlorine content.
Excellent compatibility with standard amine and anhydride curing agents.
Low viscosity (10,000–12,000 cP at 25°C) for enhanced processability and filler wetting.
Superior electrical insulation properties and thermal stability up to 130°C (UL RTI).
Consistent batch-to-batch quality meeting ISO 9001 manufacturing standards.
Electrical encapsulation and potting of transformers, reactors, and high-voltage insulators.
Structural adhesives for aerospace and automotive composite bonding.
High-performance laminating resin for FR-4 printed circuit board (PCB) substrates.
Wind turbine blade matrix resin in combination with glass or carbon fiber reinforcements.
Protective coatings for chemical-resistant flooring and industrial tank linings.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Pale yellow to water-white, transparent |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 10,000–12,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | 12–16°C |
| Storage Stability | ≥ 12 months at <25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China