High-performance bisphenol-A based liquid epoxy resin with excellent mechanical strength and chemical resistance.
Low viscosity for superior wetting and easy processing in casting, impregnation, and laminating applications.
Consistent reactivity profile ensures reliable curing behavior with standard amine and anhydride hardeners.
Low chloride content (< 500 ppm) enhances electrical insulation properties and long-term reliability in electronic encapsulation.
Excellent adhesion to metals, glass, and composite substrates without requiring surface priming.
Electrical and electronic encapsulation for transformers, reactors, and high-voltage insulators.
Structural composites in wind turbine blades and aerospace secondary components.
High-voltage bushings and insulating parts for power transmission equipment.
Prepreg systems for FR-4 and specialty laminates in printed circuit board manufacturing.
Adhesives and coatings requiring thermal stability up to 130 °C continuous service temperature.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear to pale yellow low-viscosity liquid |
| Appearance | Transparent, slightly viscous liquid at 25 °C |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25 °C) | 12,000–16,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | 12–18 °C |
| Storage Stability | ≥ 12 months at ≤ 25 °C in unopened original packaging |
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E-mail: wangxingqiang@ericwchem.com
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