High purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent adhesion to metals, glass, and composite substrates under ambient and elevated cure conditions.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing, mixing, and impregnation.
Superior electrical insulation properties and low dielectric loss at high frequencies.
Good chemical resistance to alkalis, diluted acids, and aliphatic solvents after full curing.
Electrical encapsulation and potting compounds for transformers, sensors, and power modules.
Structural adhesives for aerospace and automotive bonding applications.
Matrix resin for filament-wound composite pressure vessels and wind turbine blade components.
Coating systems for corrosion protection of steel infrastructure and marine equipment.
Printed circuit board (PCB) laminates and prepreg formulations requiring high Tg and dimensional stability.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, amber-colored liquid |
| Appearance | Homogeneous, low-viscosity liquid, free from gel particles or sediment |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chlorine Content | ≤ 700 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at ≤ 25°C in sealed original container |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China