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High reactivity with amine and anhydride hardeners for rapid cure at ambient or elevated temperatures.
Excellent adhesion to metals, composites, and cured polymer substrates without surface priming.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing, impregnation, and void-free casting.
Superior thermal stability with glass transition temperature (Tg) exceeding 125°C after full cure.
Low chloride content (<0.02%) ensuring high electrical insulation performance and corrosion resistance.
Electrical encapsulation of power electronics, transformers, and high-voltage insulators.
Structural adhesive formulation for aerospace composite bonding and automotive lightweight assemblies.
Matrix resin for filament-wound pressure vessels and carbon fiber reinforced pipes.
Underfill and conformal coating in semiconductor packaging and PCB protection.
Casting and potting of industrial sensors, LED modules, and precision optical components.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear, low-viscosity amber liquid |
| Appearance | Transparent, slightly yellowish liquid |
| Epoxy Equivalent Weight (EEW) | 175–185 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chloride Content | <0.02 wt% |
| Volatility (Loss on Heating at 150°C, 2 h) | <0.5 wt% |
| Storage Stability | 12 months at 25°C in sealed container |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
