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High reactivity with standard amine and anhydride hardeners for rapid cure at ambient or elevated temperatures.
Excellent adhesion to metals, composites, and cured polymer substrates without extensive surface pretreatment.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy handling, degassing, and impregnation of fibrous reinforcements.
Superior chemical resistance to alkalis, dilute acids, and common solvents after full cure.
Low volatile organic compound (VOC) content, supporting compliance with industrial environmental and safety regulations.
Structural adhesive formulations for aerospace composite bonding and metal-to-composite joining.
Matrix resin in filament-wound pressure vessels and high-pressure composite tanks.
Encapsulation and potting of high-reliability electronic modules requiring thermal stability and moisture resistance.
Tooling resins for manufacturing carbon fiber molds and low-temperature-cure composite tooling.
Repair compounds for corrosion-resistant coatings and industrial equipment refurbishment.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Transparent, slightly amber, homogeneous |
| Epoxy Equivalent Weight (EEW) | 175–185 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chloride Content | < 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at < 25°C in unopened original container |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
