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High reactivity with standard amine and anhydride hardeners for rapid cure at ambient or elevated temperatures.
Excellent adhesion to metals, composites, and cured polymer substrates without extensive surface pretreatment.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy handling, degassing, and impregnation of fibrous reinforcements.
Superior chemical resistance to alkalis, dilute acids, and common solvents after full cure.
Low volatile organic compound (VOC) content, supporting compliance with industrial environmental and safety regulations.
Structural adhesive formulations for aerospace composite bonding and metal-to-composite joining.
Matrix resin in filament-wound pressure vessels and high-pressure composite tanks.
Encapsulation and potting of high-reliability electronic modules requiring thermal stability and moisture resistance.
Tooling resins for manufacturing carbon fiber molds and low-temperature-cure composite tooling.
Repair compounds for corrosion-resistant coatings and industrial equipment refurbishment.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Transparent, slightly amber, homogeneous |
| Epoxy Equivalent Weight (EEW) | 175–185 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chloride Content | < 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at < 25°C in unopened original container |
Q1: What is the primary function of DY 965 Epoxy Resin in coating and adhesive formulations?
A: DY 965 Epoxy Resin serves as a reactive diluent and viscosity modifier, enhancing flow, leveling, and crosslink density while maintaining good chemical resistance and adhesion to diverse substrates.
Q2: Is DY 965 compatible with standard amine-based hardeners?
A: Yes, DY 965 exhibits broad compatibility with aliphatic, cycloaliphatic, and aromatic amine hardeners, supporting flexible cure profiles across ambient and elevated temperature conditions.
Q3: How does DY 965 compare to conventional bisphenol-A epoxy resins in terms of reactivity and final film properties?
A: DY 965 offers higher functionality and faster reaction kinetics than standard DGEBA resins, contributing to improved hardness, thermal stability, and reduced shrinkage in cured networks.
Q4: Can DY 965 be used in UV-curable systems?
A: No — DY 965 is a thermally curable epoxy resin and does not contain photoreactive groups; it is not suitable for direct UV curing without additional functionalization or co-monomer blending.
Q5: What handling precautions are recommended for safe processing of DY 965?
A: Standard industrial hygiene practices apply: use in well-ventilated areas, avoid prolonged skin contact, and wear appropriate PPE such as nitrile gloves and safety goggles; refer to the Safety Data Sheet for detailed exposure controls.
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
