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High functionality phenolic epoxy resin with multiple epoxide groups per molecule for enhanced crosslink density.
Excellent thermal stability and char yield, supporting performance in elevated-temperature environments.
Superior chemical resistance—particularly to acids, alkalis, and solvents—after full cure.
Low viscosity relative to other high-functionality phenolic epoxies, enabling improved processability and filler loading.
Designed for compatibility with conventional amine and anhydride curing agents used in high-performance composites and encapsulants.
Aerospace composite matrices requiring flame, smoke, and toxicity (FST) compliance.
Electrical encapsulation and potting compounds for high-voltage power electronics.
High-performance adhesives in structural bonding of metal and composite substrates.
Carbon fiber prepregs for defense and industrial tooling applications.
Fire-resistant printed circuit board (PCB) laminates and bonding films.
| Chemical Type | Phenolic epoxy novolac resin |
| Product Form | Off-white to light tan solid flakes or powder |
| Appearance | Free-flowing crystalline solid |
| Epoxy Equivalent Weight (EEW) | 170–190 g/eq |
| Softening Point | 85–95 °C |
| Functionality (Average Epoxide Groups per Molecule) | ≥ 4.0 |
| Volatiles Content | < 0.5 wt% |
| Primary Applications | High-temperature composites, electrical insulation, fire-safe laminates |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
